PCB - Printed Circuit Board
JAC Engineering Sdn. Bhd. is a leader in providing customized PCB/FPC covering a wide spectrum product types including Medical, Automotive, Lighting, Industrial and Telecommunication Equipment. We have been servicing both our local and overseas clients for more than a decade from rapid prototyping to mass production.
PCB Capability
- Single-sided / double-sided (rigid) PCBs
- Multi-layer (rigid) PCBs
- Burn-In board
- HDI Technology
- Buried vias, Blind vias
- Controlled impedance
- Materials include CEM1, FR4, FR404, FR5, Teflon, Getek, Microwave/High Frequency (Rogers), VT901, IS410, MP06503, Ro4350B,Ro4003C, Polyimide, etc.
- Electroless nickel/immersion gold, immersion silver, immersion tin, HASL, SMOBC finishes.
FPC
Adapting to the needs of today's electronic products to the direction of high density and high reliability, miniaturization and light weight, and also meets the strict economic requirements and the need of market and technology competition.
FPC Capability
- Single-sided / double-sided Flex/Rigid-Flex PCBs
- Multi-layer Flex/Rigid-Flex PCBs
- Materials include PI, FR4.
- Thickness of base copper 9um, 12um, 18um, 35um, 70um
- Electroless nickel/immersion gold, immersion silver, immersion tin, OSP finishes.
Genuine Quality Component
When dealing with JAC Engineering Sdn Bhd, you can be assured on the component authenticity. We are strict in providing our customer with good quality proven components when assembling clients product. Our experienced procurement team always do the best in helping customer minimize the cost without sacrificing on the component quality. Our component supply are from established global distributors or direct from manufacturer.
We are also distributor to some of the world's best Relay, Triac, SCR and SSR component manufacturer for the automotive and water heater industry.
JAC Engineering Sdn Bhd is an associate partner of HongFa relay component. Hongfa (Shanghai Stock Exchange: 600885) was founded in 1984 and has established a full-range of relay product series. Hongfa has set up three relay R&D and production bases with nearly 14,000 employees globally. Hongfa products cover various product segments including relays, low-voltage and high-voltage devices, capacitors, precision parts and automatic production equipment, which are widely used in industrial, energy, transportation, telecommunication, home appliance, and medical segment.
JAC Engineering Sdn Bhd is an authorized distributor of JJMICROELECTRONICS, a leading global IDM for quality power semiconductor devices with almost 30 years of manufacturing excellence. JJM was founded in 1995, and public listed in 2017 with 8 subsidiaries, 4 wafer fabs, 4 A&T sites, 7 R&D teams in 4 R&D centres. JJM employs over 2,000 people, with R&D accounting for 19% of the workforce. JJM manufactures the following devices:
- Thyristors [TRIAC / SCR]
- Diodes [SiC / Fast Recovery / Schottky / Zener / ESD]
- Protection Devices [TVS / TSS / MOV / GDT]
- MOSFETs [Low / Medium / High Voltage]
JAC Engineering Sdn Bhd is an authorized distributor of Xiamen Kudom Electronic Technology Co., Ltd.'s SSR and related products. Xiamen Kudom Electronic Technology Co., Ltd. was founded in 2012 and specialise in manufacturing of Solid State Relay, Motor Reversing Module, Voltage Regulator and Power Semiconductor Products. Xiamen Kudom Electronic Technology Co., Ltd. Has been granted the National High-Tech Enterprise status by the Chinese government and am certified with ISO9001:2015, ISO14001:2015, OHSAS18001:2007.
Affiliate Partner:
